SLD is fabricated with high stability of output optical power, high symmetry in the optical spectrum, and high reliability during all working temperature range.

Standard 8-pin butterfly structure is used for compacted hermetic package. The chip temperature can be controlled by external PCB to realize long term stable operation.

Technical Specification

LKF 1310nm SLD
Working Wavelength	1310nm
Spectrum Bandwidth	≥35 nm
Output Power@100mA	200~400 μW 400~800 μW ≥800 μW
Spectrum Ripple	≤0.2 dB
Polarization Extinction Ratio	≤1.2 dB or ≥12 dB
Output Power Variation at Full Temperature	≤3%
TEC Cooling Current	≤700 mA (stable working state at full temperature) ≥1200mA (quick start state)
Package	Type H, 8-pin / Type J, 6-pin
Size	22mm×12.6mm×(7.3~8.0)mm (Type H package) 16.8mm×9mm×5.7mm (Type J package)
Tail Fiber	PM/SM, ≥1m
Working Temperature	-45~+70℃
Storage Temperature	-55~+85℃

Product Code Table

Product code	Power [um]	Output pigtail	Axis Alignment	Package Type
GHCN01	＞800	125/250 PM	-	H
GHCF02	＞800	125/250 PM	Fast	H
GHCN03	400~800	125/250 PM	-	H
GHCN04	200~400	125/250 PM	-	H
GHLF02	＞800	80/165 PM	Fast	H
GHCS02	＞800	125/250 PM	Slow	H
GHLN01	＞800	80/165 PM	-	H
GJCN03	400~800	125/250 PM	-	J

Key Features

High ReliabilityHigh optical output power

Excellent stability of optical power

High PER and low PER is optional

Lower Electrical power supply

Wide working temperature range

Applications

Fiber Optic Gyroscope (FOG)

Fiber Optic Current Transformer (FOCT)

Optical Coherence Tomography (OCT)

Biomedical Imaging

Other Fiber Optic Sensing

Fig.1 Dimensions Of SLD

H Type

J Type

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